Metal fusion bonding – Process – Plural heat applying
Patent
1991-03-28
1993-06-29
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural heat applying
228242, B23K 304, H01L 2158
Patent
active
052226557
ABSTRACT:
An apparatus for applying a soldering alloy to an element to be soldered including an open-channeled member having a receiving region for holding the element, a vacuum system connected to the member for creating a negative pressure through the open channel and at the receiving region sufficient to retain the element against the receiving region, a heating coil connected to the member for conducting heat to the element at a soldering temperature, and a gas distribution and heating system for providing heated gas to a soldering alloy at a temperature sufficient to melt and provide at least one soldering connection on the heated element. The invention also comprises a method for providing heat to an element to be soldered substantially by conduction and heat to a soldering alloy substantially by convection employing a heated gas all at temperatures sufficient to provide a soldered connection without damaging the element being soldered.
REFERENCES:
patent: 3964664 (1976-06-01), Butler et al.
patent: 4426571 (1984-01-01), Beck
patent: 4799615 (1989-01-01), Davenport
patent: 4799617 (1989-01-01), Friedman
Fracassi Ugo
Moretti Sergio
Ramsey Kenneth J.
Selenia Industrie Elettroniche Associate
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