Soldering method and tool

Details Soldering method and tool Soldering method and tool

1991-03-19

1992-07-07

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228258, 228 52, B23K 100, H05K 334

Patent

active

051275724

ABSTRACT:
The method of the invention comprises the steps of locating the integrated circuit so that the projecting ends of the pins thereon are in juxtaposition with the corresponding connector pads on the printed circuit board; and applying solder to the connector pads with a heated soldering tool moving over the pads and touching the projecting ends of the pins on the integrated circuit without overlying the pins to solder the projecting ends of the pins to the connector pads. The method of the invention further comprises the step of applying a soldering flux to the pins and connector pads prior to applying the solder with the soldering iron. After the soldering operation is complete, the flux is removed with a flux remover. If the connector pads are new, a base solder is applied to the connector pads prior to placement of the integrated circuit on the printed circuit board.

REFERENCES:
patent: 1172161 (1916-02-01), Moench
patent: 1741707 (1929-12-01), Miller
patent: 2382390 (1945-08-01), Bergman
patent: 3580462 (1971-05-01), Vanyi
patent: 3941292 (1976-03-01), Osipov et al.
patent: 4607151 (1986-08-01), Kihlstrom

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