Soldering method and system thereof

Details Soldering method and system thereof Soldering method and system thereof

2011-03-08

2011-03-08

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

C228S123100

Reexamination Certificate

active

07900808

ABSTRACT:
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.

REFERENCES:
patent: 2004/0036181 (2004-02-01), Hedler et al.
patent: 2004/0134976 (2004-07-01), Keyser et al.
patent: 2007/0139134 (2007-06-01), Ratell et al.
patent: 2009/0051004 (2009-02-01), Roth et al.

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