Soldering method and soldering apparatus

Details Soldering method and soldering apparatus Soldering method and soldering apparatus

1998-06-18

2000-09-26

Ryan, Patrick

Metal fusion bonding

Process

Using high frequency vibratory energy

228219, 228262, B23K 106, B23K 2010, B23K 3102, B23K 3538

Patent

active

061232483

ABSTRACT:
Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

REFERENCES:
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4610391 (1986-09-01), Nowotarski
patent: 4868034 (1989-09-01), Steinberg
patent: 5368814 (1994-11-01), Gonya et al.
patent: 5427303 (1995-06-01), Nowotarski
patent: 5451247 (1995-09-01), Gross et al.
patent: 5569433 (1996-10-01), Chen et al.
patent: 5667849 (1997-09-01), Carey, II et al.
patent: 5695822 (1997-12-01), Carey, II et al.
patent: 5718868 (1998-02-01), Ninomiya et al.
patent: 5730932 (1998-03-01), Sarkhel et al.
patent: 5759379 (1998-06-01), Cavallotti et al.
patent: 5783059 (1998-07-01), Cavallotti et al.
patent: 5990564 (1999-11-01), Degani et al.

Affiliated with

Also associated with

Rating

Soldering method and soldering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering method and soldering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering method and soldering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2093123