Soldering method and soldering apparatus

Details Soldering method and soldering apparatus Soldering method and soldering apparatus

1995-06-22

1997-02-25

Heinrich, Samuel M.

Metal fusion bonding

Process

Applying or distributing fused filler

2281801, 228 33, B23K 306, B23K 100

Patent

active

056052766

ABSTRACT:
The improvement in the soldering method comprising the steps of feeding a predetermined volume of solid solder to a solder melting pot, heating and melting the solder in the pot, and then dropping the molten solder onto a workpiece. A wire solder is held between at least one pair of endless running belts which run with opposed faces thereof in contact with each other thereby to straighten the wire solder. The tip-end of the straightened wire solder is pressed against the solder melting pot to melt the wire solder from the tip-end. On completion of feeding a predetermined volume of the wire solder, the running belts are run in reverse to retreat the tip-end of the wire solder from the solder melting pot. A soldering apparatus for realizing the aforementioned method is also provided.

REFERENCES:
patent: 5038995 (1991-08-01), Nagata
patent: 5238176 (1993-08-01), Nishimura
patent: 5297718 (1994-03-01), Nagata
patent: 5361963 (1994-11-01), Ozawa et al.
patent: 5364011 (1994-11-01), Baker et al.
Patent Abstracts of Japan, vol. 10 No. 238 (M-508), Aug. 16, 1986, & JP-A-61 071174 Apr. 12, 1986, *abstract

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