Soldering method and soldering apparatus

Details Soldering method and soldering apparatus Soldering method and soldering apparatus

1990-01-10

1991-08-13

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 8, B23K 306

Patent

active

050389955

ABSTRACT:
A method of applying molten solder onto a desired point of a small workpiece, such as a printed circuit board, under well-controlled condition. A solter tip is temporarily held above a solder melting pot and then allowed to fall into a solder melting pot in which the solder tip is melted and held for a pre-set time duration. In this manner, the scattering in velosity of the falling solder and the dislocation of the fallen tip are minimized to control the temperature of the molten solder precisely. A soldering apparatus used for the practice of the method of this invention is also provided. In a preferred embodiment, the soldering apparatus is provided with means for removing the debris sticking to the inner face of the solder melting pot.

REFERENCES:
patent: 2415542 (1947-02-01), Vawryk
patent: 3015137 (1962-01-01), Hoebing
patent: 4595816 (1986-06-01), Hall et al.

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