Soldering method and solder joint member

Details Soldering method and solder joint member Soldering method and solder joint member

2005-06-07

2005-06-07

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Applying or distributing fused filler

C228S180100, C228S223000, C228S214000

Reexamination Certificate

active

06902102

ABSTRACT:
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

REFERENCES:
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patent: 2001-168513 (2001-06-01), None
patent: 2001-293559 (2001-10-01), None
patent: 2001-358456 (2001-12-01), None
SMT Lift-off Phenomenon on Lead-Free Solder, Proceedings of the 15thJIEP Annual Meeting, (Mar. 2001) pp. 309-310.

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