Soldering method and solder joint

Details Soldering method and solder joint Soldering method and solder joint

1978-06-05

1979-12-11

Husar, Francis S.

Metal fusion bonding

Process

Plural heat applying

228238, 228263, 428674, B23K 102, B23K 3526

Patent

active

041779169

ABSTRACT:
Soldering method comprises placing a cadmium-zinc-lead solder on a copper base and exposing the solder joint to about 200.degree. C. for at least one hour to produce a copper-cadmium-zinc ternary interface barrier layer which inhibits migration.

REFERENCES:
patent: 1333619 (1920-03-01), Hill
patent: 2102998 (1937-12-01), Darby et al.
patent: 2372745 (1945-04-01), Smith, Jr.
patent: 2945296 (1960-07-01), Jones et al.
patent: 3411961 (1968-11-01), Harvey
patent: 3733182 (1973-05-01), Crossland et al.

Affiliated with

Also associated with

Rating

Soldering method and solder joint does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering method and solder joint, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering method and solder joint will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-306550