Soldering method and apparatus utilizing dual solder waves of di

Details Soldering method and apparatus utilizing dual solder waves of di Soldering method and apparatus utilizing dual solder waves of di

1977-08-31

1978-07-18

Kelly, Donald G.

Metal fusion bonding

Process

Plural joints

228 37, 228260, B23K 102, H05K 334

Patent

active

041010663

ABSTRACT:
In the wave soldering of terminals of an electrical device, such as a miniaturized printed circuit board assembly, the board is moved along a predetermined path so that it initially engages a first solder wave flowing counter to the direction of the board movement and subsequently engages a second solder wave flowing in the direction of board movement. The velocity of the solder in each of the solder waves is controlled independently by having separate independent pumping systems. Thus, the solder waves can be set at different independent velocities to achieve proper soldering of the terminals and associated conductor paths while reducing crossovers or bridges (i.e., shorts) between the terminals and the conductor paths as a result of the close spacing thereof.

REFERENCES:
patent: 3039185 (1962-06-01), Oates
patent: 3119363 (1964-01-01), Rieben
patent: 3482755 (1969-12-01), Raciti
patent: 3565319 (1971-02-01), Eschenbrucher
patent: 3993235 (1976-11-01), Boynton

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