Soldering method and apparatus

Details Soldering method and apparatus Soldering method and apparatus

1992-11-02

1993-08-10

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228224, 228 205, 228 52, 392476, 392385, 219227, 219229, B23K 100, B23K 300

Patent

active

052341577

ABSTRACT:
An component or connector lead (12) is soldered to a bare copper metallized area (14) on a circuit board (16) using core solder (26) by manually applying heat from a heated tip (24) to a separate one of the lead and metallized area. As the heat is being applied, a vacuum is drawn in the region where the solder is applied to the lead and/or metallized area to draw off any flux vapors created upon heating of the solder. At the same time, hot air is also directed into the region where the solder is being applied to maintain the flux vapors, created upon heating of the solder, in their vaporous state to facilitate such vapors being drawn off, thereby reducing the amount of flux residues resulting from the soldering operation.

REFERENCES:
patent: 3735911 (1973-05-01), Ward
patent: 3918146 (1975-11-01), Hartleroad et al.
patent: 5182435 (1993-01-01), Wang
Sales brochure, "The Power in Purification," by Impell Corp., dated Jun. 1992.
Sales brochure, "Weller.RTM. Fumex," by Weller Corp., dated Dec. 1991.

Affiliated with

Also associated with

Rating

Soldering method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1720270