Soldering method and apparatus

Details Soldering method and apparatus Soldering method and apparatus

1993-06-16

1994-08-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228224, 228230, B23K 100, B23K 1012

Patent

active

053400160

ABSTRACT:
A technique is provided for manually performing a soldering operation on an article with a low-solids flux-containing solder to bond an object to the article with a reduced amount of flux residues. The technique is practiced by first manually applying heat to the article and to the object which is in contact therewith, such as by contacting the article and/or object with a heated tip of a soldering pencil, iron or gun. Once the object and article have been heated, a low-solids flux-containing solder is then applied so as to be reflowed upon contact with the heated article and the object in order to bond them together when the solder solidifies. Simultaneously, heated air (i,e., air heated above the ambient temperature) is directed at the article and the object towards the region where the solder is being applied to maintain any flux vapors, which were created upon heating of the solder, in their vaporous state. The heated air prevents condensation, and therefore unwanted deposition, of flux residues on the soldered article.

REFERENCES:
patent: 4771929 (1988-09-01), Bahr et al.
patent: 5182435 (1993-01-01), Wang
patent: 5222655 (1993-06-01), Moretti
patent: 5234157 (1993-08-01), Fletcher et al.

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