Soldering method

Details Soldering method Soldering method

1992-05-01

1992-12-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228215, 228223, 228254, 228258, H05K 334

Patent

active

051728524

ABSTRACT:
An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of the solder pads. The entire assembly is then heated to melt the solder, thereby causing the melted solder to flow across the solder pad bridging portion and form a fillet between the solder pad terminal portion and the component terminal.

REFERENCES:
patent: 4376505 (1983-03-01), Wojcik
patent: 4817850 (1989-04-01), Wiener-Avnear et al.
patent: 4821946 (1989-04-01), Abe et al.
patent: 4836435 (1989-06-01), Napp et al.
patent: 4851966 (1989-07-01), Roback et al.
patent: 5011066 (1991-04-01), Thompson

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