Soldering method

Details Soldering method Soldering method

2006-12-05

2009-02-17

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S846000, C228S180100, C228S180210

Reexamination Certificate

active

07490403

ABSTRACT:
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

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SMT Lift-off Phenomenon on Lead-Free Solder, Proceedings of the 15thJIEP Annual Meeting (Mar. 2001), pp. 309-310.

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