Soldering method

Details Soldering method Soldering method

1996-04-22

1998-01-20

Bradley, P. Austin

Metal fusion bonding

Process

Plural filler applying

2282332, B23K 119, B23K 3514, B23K 3524

Patent

active

057093385

ABSTRACT:
A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.

REFERENCES:
patent: 5540379 (1996-07-01), Kazem-Goudarzi et al.

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