Soldering material and procedure

Details Soldering material and procedure Soldering material and procedure

1993-11-24

1995-01-31

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

2282481, B23K 3102

Patent

active

053852907

ABSTRACT:
The quality of soldering produced on devices such as printed circuit boards and multichip modules is significantly improved through use of a specific size distribution of solder particles. In particular, the solder includes a vehicle and solder particles of specific size. In general, an appropriate distribution of both large and small particles should be employed. Through this expedient short circuits and soldering defects in fine line devices are reduced.

REFERENCES:
patent: 4509994 (1985-04-01), Barajas
patent: 4531986 (1985-07-01), Barajas
patent: 4731130 (1988-03-01), O'Leary
patent: 4740252 (1988-04-01), Hasegawa et al.
Tummala, R. R., Microelectronics Packaging Handbook, pp. 366-391 and 819-836, Van Nostrand Reinhold, New York, N.Y. (1989).
Hwang, J. S., Solder Paste in Electronic Packaging, pp. 172-174 and 180-181, Van Nostrand Reinhold, New York, N.Y. (1989).
Johnson, C. C. et al., Solder Paste Technology, pp. 42-47, TAB Booke Inc., Blue Ridge Summit, Pa. (1989).
Hwang, J. S., Solder Paste in Electronic Packaging, pp. 91-99, Van Nostrand Reinhold, New York, N.Y. (1989).

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