Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1990-10-24
1994-05-03
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174250, 361767, H05K 100
Patent
active
053089286
ABSTRACT:
A structure and method for selectively forming interconnections between the interconnect lines of a printed circuit board. At the same time solder is deposited through a solder application mask to bond the modules to the board, solder is also deposited on pad interconnect structures between the interconnect lines. Thus, line interconnections can be formed at minimal additional cost, reducing the number of different boards needed to mount different sets of modules or alternate component or circuit configurations. In a preferred embodiment, the pads comprise an arcuate member and an elongated member extending within the arc described by the arcuate member. By optimizing the spacing between the members, the total area of the members, and the volume of the solder, a highly reliable solder fillet interconnection can be formed.
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patent: 4426775 (1984-01-01), Faust et al.
patent: 4980240 (1990-12-01), Dunaway
patent: 5130779 (1992-07-01), Agarwala
L. A. Harlow, "Re-Usable Interconnection Matrix," IBM Technical Disclosure Bulletin, vol. 13, No. 2, Jul. 1970, p. 433.
L. F. Miller et al., "Nonconcentric Solder Reflow Technique for Close-Packed Lands," IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, pp. 155-155a.
Parla Anthony J.
Tepper Howard F.
Chadurjian Mark F.
Figlin Cheryl R.
International Business Machines - Corporation
Picard Leo P.
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