Soldering interconnect method and apparatus for semiconductor pa

Details Soldering interconnect method and apparatus for semiconductor pa Soldering interconnect method and apparatus for semiconductor pa

1988-12-19

1991-04-02

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 68, 357 69, 357 70, 361386, H01L 2302, H01L 2312, H01L 3902, H01L 2944

Patent

active

050050702

ABSTRACT:
A method and apparatus for attaching the outer leads of a semiconductor package (preferably a Tape Automated Bonded circuit) to the traces on a printed circuit board is described. The outer leads of the package are configured in an angled orientation so that the tip of each lead extends downwardly below the lower surface of the package. As a result, placement of the package against the circuit board causes the leads to be biased downwardly against the traces. In order to accomplish this, the package is secured to the board using a rigid frame structure. The frame structure urges the edges of the package against the board. This insures that the leads make electrical contact with the traces in a fast and efficient manner, while avoiding problems associated with a lack of lead coplanarity.

REFERENCES:
patent: 4446477 (1984-05-01), Currie et al.
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4724280 (1988-02-01), Tsuji et al.
Rima, P. W., "The Basics of Tape Automated Bonding", Hybrid Circuit Technology, Nov. 1984.

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