Soldering foil for stress-free joining of ceramic bodies to meta

Details Soldering foil for stress-free joining of ceramic bodies to meta Soldering foil for stress-free joining of ceramic bodies to meta

1984-12-14

1985-12-31

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428671, 428673, 228 563, 228122, 22826312, B23K 3520, B23K 3540

Patent

active

045621217

ABSTRACT:
A soldering foil having a multi-layer structure for the stress-free joining of ceramic bodies to metal is described along with a process for making the foil. The soldering foil contains two layers of an active solder, particularly a Cu/Ti solder, provided with an intermediate cushion layer, preferably of copper, which absorbs the stresses. Between the copper cushion layer and the active solder layers barrier layers of silver are arranged which are very thin in relation to the copper and solder layers. The soldering foil permits a low-stress and extremely durable connection to be established between metal and ceramic, simultaneously permitting relatively large deviations in the temperature and time parameters of the soldering process.

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patent: 4448853 (1984-05-01), Fischer et al.
"High Temperature Metal Ceramic Seals", Harry Bender, Ceramic Age, Apr. 1954, pp. 15-47.
"Metal to Nonmetal Brazing", Pearsell et al., Research Laboratory of Electronics--MIT, Technical Report No. 104, Apr. 5, 1949.

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