Soldering flux, soldering paste and soldering method using the s

Details Soldering flux, soldering paste and soldering method using the s Soldering flux, soldering paste and soldering method using the s

1995-12-06

1999-07-06

Ryan, Patrick

Metal treatment

Compositions

Fluxing

148 22, 148 23, 148 25, 148 26, B23K 35363

Patent

active

059193174

ABSTRACT:
Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

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