Soldering flux, solder paste and method of soldering

Details Soldering flux, solder paste and method of soldering Soldering flux, solder paste and method of soldering

2005-07-12

2005-07-12

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C148S023000

Reexamination Certificate

active

06915944

ABSTRACT:
The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with a smaller pitch. A flux3contains an adhesive resin and a hardening agent. This flux or a soldering paste containing the flux is applied onto a component mounting board1, and then, an electronic component4is mounted and soldered onto the component mounting board1.

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