Soldering flux and method of its use in fabricating and assembli

Details Soldering flux and method of its use in fabricating and assembli Soldering flux and method of its use in fabricating and assembli

1990-07-02

1991-04-23

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

228207, B23K 3534

Patent

active

050097245

ABSTRACT:
A water-soluble soldering flux which does not adversely impact the surface insulation resistance of a circuit board is comprised of a water-soluble vehicle, an activator and a hydrophobic surfactant preferentially adsorbed at the board surface. At soldering temperatures, the activator reacts to clean metallized areas on a circuit board and promote solder wetting. The hydrophobic surfactant, which is preferentially adsorbed at the board surface, acts to block the diffusion of hydrophilic vehicle molecules into the board which would otherwise degrade the board's surface insulation resistance.

REFERENCES:
patent: 2806808 (1957-09-01), Muetzel
patent: 3158120 (1964-11-01), Von Hessert
patent: 4342607 (1982-08-01), Zado
patent: 4441938 (1984-04-01), Poliak
patent: 4478650 (1984-10-01), Zado
patent: 4561913 (1985-12-01), Zado
patent: 4762573 (1988-08-01), Biverstedt

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