Soldering flux and method for bonding semiconductor element

Details Soldering flux and method for bonding semiconductor element Soldering flux and method for bonding semiconductor element

2006-06-27

2010-06-29

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

Reexamination Certificate

active

07743966

ABSTRACT:
The method for bonding a semiconductor element comprises the step of applying to solder bumps10of a semiconductor chip12a soldering flux16which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of reflow-bonding the solder bumps10to the electrodes18of the circuit board20with the soldering flux16while melting the solder bumps10,and the step of filling an underfill material22between the semiconductor chip12and the circuit board20with the soldering flux16being left, the underfill material22containing a thermosetting resin of the same group as the thermosetting resin contained in the soldering flux16and at least one of a curing agent and a cure catalyst for curing the thermosetting resins.

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patent: 2004-1030 (2004-01-01), None

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