Soldering flux

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

106230, 148 23, 148 25, 260 27R, B05D 300, B23K 3534, C08L 9106, C08L 9304

Patent

active

042398126

ABSTRACT:
Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F. In a preferred embodiment of the invention compatible flux active agents and/or wetting agents may be intermixed with the liquid material whereby the board and component leads may be fluxed simultaneously with treating to temporarily stabilize the components in the board.

REFERENCES:
patent: 2216435 (1940-10-01), Eckel
patent: 2470957 (1949-05-01), Strader
patent: 2575413 (1951-11-01), Franklin
patent: 2857350 (1958-10-01), Thompson et al.
patent: 3436278 (1969-04-01), Poliak
patent: 3775146 (1973-11-01), Reckziegel et al.
patent: 3954494 (1976-05-01), Stayner et al.
patent: 3973322 (1976-09-01), Boynton
patent: 4060191 (1977-11-01), Choby
patent: 4118861 (1978-10-01), Palmisano
Printed Circuits Handbook, C. F. Coombs, Jr., pp. B-5 to B-15, 1967.
Candle Crafting From an Art to a Science, W. Nussle, 1972, pp. 60-76.

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