Soldering flux

Metal treatment – Compositions – Fluxing

Patent

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Details

148 24, B23K 3534

Patent

active

054177715

ABSTRACT:
A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons.
A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.

REFERENCES:
patent: 5127968 (1992-07-01), Gomi
patent: 5131962 (1992-07-01), Minahara et al.
patent: 5167729 (1992-12-01), Takemoto et al.
Derwent Abstract, JP-4-37497 (Feb. 7, 1992).

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