Soldering flux

Metal fusion bonding – Process – With protecting of work or filler or applying flux

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

106219, 106243, 148 23, 148 25, B23K 3102

Patent

active

039441237

ABSTRACT:
Dimerised and trimerised unsaturated aliphatic monocarboxylic acids having at least 10 carbon atoms are advantageous in or as fluxes for soldering of tin plate. Especially valuable novel fluxes for this purpose comprise, in free acid or ammonium or amine salt form, (1) at least one compound selected from the group consisting of C.sub.7.sub.-11 aliphatic monocarboxylic acids and acid organic phosphates and (2) at least one substance selected from the group consisting of dimerised and trimerised unsaturated aliphatic monocarboxylic acids having at least 10 carbon atoms, saturated C.sub.12.sub.-36 aliphatic monocarboxylic acids and rosin.

REFERENCES:
patent: 1208799 (1916-12-01), Kriews
patent: 2361867 (1944-10-01), Pessel
patent: 2658846 (1953-11-01), De Rosa
patent: 2674554 (1954-04-01), Snell
patent: 2774137 (1956-12-01), Yarow
patent: 2845700 (1958-08-01), Bagno
patent: 3223635 (1965-12-01), Dwyer
patent: 3640860 (1972-02-01), Miller

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Soldering flux does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering flux, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering flux will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-288153

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.