Soldering external leads to film circuits

Details Soldering external leads to film circuits Soldering external leads to film circuits

1983-08-05

1986-04-01

Jordan, Charles T.

Metal fusion bonding

Process

With removing or reshaping of filler material or flash after...

228 40, B23K 3100, B23K 108

Patent

active

H00000540

ABSTRACT:
Disclosed is a method of soldering external leads to film circuits formed on insulating substrates. The leads, usually in the form of lead frames, are clipped onto the substrates and a flux is applied. The assemblies are then immersed into molten solder. As they are withdrawn from the solder, they pass through high-pressure hot gas jets which remove the excess solder.

REFERENCES:
patent: Re30399 (1980-09-01), Ammonn et al.
patent: 3605244 (1971-09-01), Osborne et al.
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3713876 (1973-01-01), Lavric
patent: 3874068 (1975-04-01), Cook
patent: 4315042 (1982-02-01), Spigarelli
patent: 4401253 (1983-08-01), O'Rourke
patent: 4402448 (1983-09-01), O'Rourke
patent: 4410126 (1983-10-01), O'Rourke
"Solder Coating and Air Leveling of PC Boards", Electronic Packaging and Production, Jul. 1977, pp. 24-31.

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