Soldering device for electronic elements

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component

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Details

228212, 269903, B23K 300, B23K 3704

Patent

active

051783150

ABSTRACT:
A device for soldering an electronic element to a substrate has a support head for supporting the substrate, and a pusher having a push head provided above the support head for pushing the electronic element to the substrate. The holder is upwardly moved to push the element to the substrate.

REFERENCES:
patent: 3442432 (1969-05-01), Santangini
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 3998377 (1976-12-01), Metz

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