Soldering device

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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Details

118429, B23K 306

Patent

active

047735830

ABSTRACT:
A soldering device wherein the article to be soldered is moved into contact with molten solder which flows in the direction counter to the direction of movement of said article is characterized by including a nozzle for flowing said molten solder and a flow path of a channel shape provided contiguous thereto for circulating said molten solder flowed out of said nozzle, said flow path having side-wall plates which are vertically adjustable.

REFERENCES:
patent: 4315590 (1982-02-01), Kondo
patent: 4465014 (1984-08-01), Bajka
patent: 4465219 (1984-08-01), Kondo
patent: 4530457 (1985-07-01), Down
patent: 4545520 (1985-10-01), Kent
patent: 4568016 (1986-02-01), Payne
patent: 4632291 (1986-12-01), Rahn

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