Soldering device

Metal fusion bonding – Metallic heat applicator – With means to handle flux or filler

Patent

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Details

219230, B23K 306

Patent

active

049365010

ABSTRACT:
A soldering device has a container for accommodating solder bodies, a soldering head, a tubular guide for guiding the solder bodies to the soldering head, and a slider formed to take the solder bodies from the container and transfer them into the tubular guide.

REFERENCES:
patent: 2447110 (1948-08-01), Bitzenburger
patent: 2458319 (1949-01-01), Uhing
patent: 3146747 (1964-09-01), Stebbing, Jr.
patent: 4773582 (1988-09-01), Vella

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