Soldering/desoldering nozzles for SMD's

Details Soldering/desoldering nozzles for SMD's Soldering/desoldering nozzles for SMD's

1994-03-16

1996-12-03

Elpel, J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228264, B23K 1012, B23K 300

Patent

active

055799795

ABSTRACT:
An apparatus for soldering/unsoldering SMD components comprising a heating nozzle which both permits direct heating of the component by contact with a hot nozzle bottom and directs a stream of hot gas onto the leads of the components. The nozzle bottom is preferably made of highly thermoconductive material and the hot gas stream is directed onto the leads by means of at least one outlet slot in the nozzle bottom adjacent the nozzle wall. The nozzle further comprises a centered suction means for positioning/removing the component.

REFERENCES:
patent: 4295596 (1981-10-01), Doten et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 4828162 (1989-05-01), Donner et al.
patent: 5139193 (1992-08-01), Todd
patent: 5222649 (1993-06-01), Funari et al.
patent: 5309545 (1994-05-01), Spigarelli et al.
patent: 5419481 (1995-05-01), Lasto et al.

Affiliated with

Also associated with

Rating

Soldering/desoldering nozzles for SMD's does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering/desoldering nozzles for SMD's, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering/desoldering nozzles for SMD's will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-779622