Soldering composition and method of use

Details Soldering composition and method of use Soldering composition and method of use

1983-01-07

1984-05-29

Ramsey, Kenneth J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

228110, 228220, 22826311, 22826318, 420524, 420521, 428674, B23K 3528, B32B 1501

Patent

active

044515413

ABSTRACT:
A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It can be used with or without a flux. It has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.

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