Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1995-07-26
1997-04-01
Bradley, P. Austin
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228 41, 228 565, 228246, B23K 100, B23K 3102
Patent
active
056158238
ABSTRACT:
In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the soldering balls from the soldering ball feeder. On the way to the workpiece, light is irradiated onto the bottom of the pickup head from the exterior. When the light leaks into the pickup head, the leakage light is detected by a light detector provided in the pickup head so that presence of a soldering-ball pickup error is determined. On the other hand, on the way to the soldering ball feeder after mounting the soldering balls onto the workpiece, light is irradiated along the bottom of the pickup head from one side. Accordingly, when the light is not received at the opposite side, at least one soldering ball remains attached to the bottom of the pickup head so that presence of a soldering-ball mounting error is determined.
REFERENCES:
patent: 5467913 (1995-11-01), Namekawa et al.
A. S. Cammarano et al., "Optical Testing of Solder Pads," IBM Tech. Discl. Bull., vol. 21, No. 7 (Dec. 1978) pp. 2914-2915.
"Illumination Method For Chip Inspection," IBM Tech. Discl. Bull., vol. 32, No. 12 (May, 1990) pp. 223-224.
Nakazato Siniti
Noda Kazuhiro
Bradley P. Austin
Knapp Jeffrey T.
Matsushita Electric - Industrial Co., Ltd.
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