Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1993-11-12
1996-01-02
Walberg, Teresa J.
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219400, 55267, 55269, F27B 904, F27B 930
Patent
active
054810876
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a soldering device comprising: for soldering; cleaning device is connected to the chamber with a feed line and a discharge line; and
Such a soldering device is known from U.S. Pat. No. 4,951,401.
The filter used in this known soldering device serves to remove waste products from the gases present in the soldering chamber. These waste products occur as a consequence of the soldering process taking place in the soldering chamber, for instance as a result of the reflow-soldering process, wherein the solder paste comprises substances which evaporate on heating. Waste products can further occur for instance due to evaporation of the fluxes used during the normal soldering using a solder wave.
These waste products are present in the soldering chamber mainly in gaseous form. When these gases are passed through the filter they will scarcely be restrained by the filter, so that the greater part of these waste products is fed back again to the soldering chamber and the filter has hardly any effect.
The object of the present invention is to provide such a soldering device wherein the filter is effective.
This object is achieved in that a cooling device is arranged in one of the lines.
As a result of this step the gases flowing through the filter have a lower temperature so that condensation of the harmful substances can occur and these remain behind in the filter. The effectiveness of the filter is thus increased.
According to a preferred embodiment the cooling device is combined with the cleaning device into one unit.
It will be apparent that, when cooling and cleaning take place inside the same unit, the effectiveness of the cleaning is greatest; precisely at the position where they are removed the harmful substances are cooled in order to cause condensation. Condensation therefore occurs at the location where the separation of the liquid substances takes place most effectively.
According to a second preferred embodiment the unit is adapted for stepwise alternating cooling of the gas and cleaning thereof by means of filters. This step also results in an improved effectiveness of the cleaning process.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will subsequently be elucidated with reference to the annexed figures, in which:
FIG. 1 shows a schematic sectional view of a first embodiment of a device according to the invention;
FIG. 2 shows a partly broken away perspective view of a second embodiment of the device according to the invention; and
FIG. 3 is a sectional view of a combination of a filter and a cooling unit for use with an embodiment according to the invention.
DETAILED DESCRIPTION OF THE INVENTION
The soldering device 1 shown in FIG. 1 comprises a soldering chamber 2 in which are arranged heating elements 3 in the form of infrared radiators. However, it is also possible to employ other heating elements.
A conveyor belt 4 is arranged in the soldering chamber for transporting the printed circuit boards for soldering, while at both the inlet side and the outlet side the soldering chamber is closed off by means of the respective doors 5, 6. Located upstream of door 5 is a first lock chamber 7 which is closed off from the outside environment by means of a door 8. Located downstream of door 6 is a lock chamber 9 which is separated from the outside environment by a door 10. Further arranged in the lock chambers are respective conveyor belts 11 and 12.
The operation of this soldering device is such that the printed circuit boards for soldering supplied from outside are carried through the opened door 8 to the lock chamber 7, whereafter the door 8 closes, the door 5 is opened and the printed circuit board for soldering is carried by the conveyor belt 11 to soldering chamber 2 where it is transported by the conveyor belt present therein. While they are moving through soldering chamber 2 on conveyor belt 4 the objects for soldering are heated by the heating devices 3. The heating devices 3 are controlled herein such that a certain heating profile results.
REFERENCES:
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patent: 1335348 (1920-03-01), Patrick et al.
patent: 1680840 (1928-08-01), Barnebey
patent: 3752642 (1973-08-01), Early et al.
patent: 3782115 (1974-01-01), Johnson
patent: 3982588 (1976-09-01), Darm
patent: 4951401 (1990-08-01), Suzuki et al.
Pelham J.
Soltec B.V.
Walberg Teresa J.
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