Soldering apparatus with adapted soldering tower

Details Soldering apparatus with adapted soldering tower Soldering apparatus with adapted soldering tower

1993-12-30

1995-05-30

Bradley, P. Austin

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228260, 118410, B23K 306, B23K 108

Patent

active

054194822

ABSTRACT:
The invention relates to a soldering apparatus comprising: a vessel for liquid solder; at least one soldering tower placed in the vessel for causing liquid solder to leave the soldering tower on the upper side, wherein the soldering tower is adapted to cause the liquid solder to run off on all sides; a conveyor for carrying objects for soldering along the top side of the soldering tower such that the objects for soldering come into contact with the liquid solder; and a cover for maintaining an atmosphere with a reduced oxygen content at least in the surrounding area of the liquid solder.

REFERENCES:
patent: 3612388 (1971-10-01), Wegener et al.
patent: 4465219 (1984-08-01), Kondo
patent: 4821947 (1989-04-01), Nowotarski
patent: 5240169 (1993-08-01), Gileta

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