Soldering apparatus with abrupt separation of solder streams

Details Soldering apparatus with abrupt separation of solder streams Soldering apparatus with abrupt separation of solder streams

1994-12-05

1997-05-20

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228260, 118429, B23K 306

Patent

active

056305427

ABSTRACT:
The invention relates to a soldering apparatus, comprising a solder vessel; at least one soldering tower located in said solder vessel; transport means for transporting objects to be soldered over said soldering tower; solder wave generating means for generating a solder wave emerging from the apex of the soldering tower and contacting the objects to be soldered, the soldering tower comprising a weir such that at least a part of the solder wave flows parallel to the direction of movement of the objects to be soldered over said weir; and guide means for guiding said part of the solder wave such that the solder wave leaves the soldered object substantially abruptly. As a consequence of said feature the stream of solder is abruptly guided away from the printed circuit board, so that the possibilities for developing short circuits on the printed circuit board are substantially reduced.

REFERENCES:
patent: 3119363 (1964-01-01), Rieben
patent: 4465014 (1984-08-01), Bajka et al.
patent: 4981249 (1991-01-01), Kawashima et al.
patent: 5379931 (1995-01-01), Van Shaik
patent: 5388752 (1995-02-01), Kawakatsu

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