Soldering apparatus of a reflow type

Details Soldering apparatus of a reflow type Soldering apparatus of a reflow type

1989-10-03

1991-11-19

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

2281801, 392360, 432128, F27B 924, B23K 1005

Patent

active

050668501

ABSTRACT:
A soldering apparatus of a reflow type contains a preheating chamber and a reflow chamber which are provided with a plurality of heaters for heating printed circuit boards with chips temporarily mounted thereon with solder pastes during conveyance by a conveyor. The heaters are mounted on the side walls of the chamber, extending along a direction of conveyance of the printed circuit boards. The chambers are also provided with a screening member respectively so as to prevent direct radiation of radiant heat from the heaters into the chambers and onto the printed circuit boards and to provide a uniform air flow so as to be blown uniformly onto the printed circuit boards.

REFERENCES:
patent: 1949716 (1934-03-01), Harsch
patent: 4938410 (1990-07-01), Kondo
Journal of Electronic Engineering, vol. 25, No. 262, Oct. 1988; pp. 46-48; S. Takazawa, "Innovations in Soldering Equipment and Technology".
Feinwerktechnik & Messtechnik, vol. 97, No. 5, May 1989, pp. 215-217, E. J. Duhm, "Infrarot-Reflow-Loten in der SMD-Technik".

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