Soldering apparatus having at least one stirrup electrode

Details Soldering apparatus having at least one stirrup electrode Soldering apparatus having at least one stirrup electrode

1990-01-02

1991-05-21

Heinrich, Sam

Metal fusion bonding

Metallic heat applicator

228 55, 219 8518, 219233, 219243, B23K 2002

Patent

active

050168045

ABSTRACT:
The soldering apparatus using at least one resistance heated stirrup electrode that is place onto soldering locations on a printed circuit board includes a pivotable suspension of the stirrup electrode. The pivotable suspension is such that a dislocated rotational axis of pivotable suspension lies in a plane of the working surface and extends perpendicular to a long side of the rectangular working surface of electrode and at the center thereof. The working surface of the stirrup electrode thus achieves reliable contact with parts to be soldered. Embodiments having two or four soldering stirrups, each individually pivotly suspended, are also possible.

REFERENCES:
patent: 4768702 (1988-09-01), Takahashi et al.
patent: 4851648 (1989-07-01), Jacobs et al.
patent: 4875614 (1989-10-01), Cipolla et al.
patent: 4894506 (1990-01-01), Woerner
IBM Technical Disclosure Bulletin, "Self Leveling Soldering Tool", vol. 11, No. 8, p. 1026, Jan. 1969.

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