Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1982-06-11
1984-05-29
Ramsey, Kenneth J.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 57, 98115R, 156 63, H05K 334
Patent
active
044510004
ABSTRACT:
The present invention provides an improvement in a circuit board mass soldering apparatus wherein a circuit board is contacted with molten solder at a soldering station and excess solder is removed from the surface of the board while still molten by impingement of a high velocity heated gas stream thereon, by providing a substantially horizontal louvered exhaust system adjacent to and in advance of the mass soldering station, below the travel path of the boards. The louvers extend and open into the path of the effluent gas stream such that the momentum of the gas stream carries it and entrained soldering fumes and particulates into the louvers to the underside thereof from which it may be exhausted by conventional means.
REFERENCES:
patent: 2141403 (1938-12-01), Offen
patent: 4351267 (1982-09-01), Kalbskopf et al.
patent: 4401253 (1983-08-01), O'Rourke
"Insulation/Circuits"; vol. 27, No. 4, Apr. 1981 pp. 31-34.
Hollis Engineering, Inc.
Ramsey Kenneth J.
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