Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate
2009-12-01
2010-12-07
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
C228S043000, C228S248100
Reexamination Certificate
active
07845541
ABSTRACT:
A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a convey mechanism capable of transmitting the fixture downstream, a daubing device, and a soldering device. The daubing device has a level movable element capable of moving along a convey direction of the convey mechanism, and a vertical movable element mounted on the level movable element and capable of moving along an upward and downward direction. A carrier mounted to the vertical movable element has a solder paste can for loading the solder paste, and an output portion for dispensing the solder paste to the soldering area. The soldering device has a soldering head heating the solder paste for shrinking the insulator, with the core wire exposing and connected to the soldering area by the cool solder paste.
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Chen Lu Yang
Cheng Riguang
Zhang Hua
Zheng Yong
Cheng Uei Precision Industry Co. Ltd.
King Anthony
Stoner Kiley
WPAT, P.C.
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