Soldering apparatus and method

Details Soldering apparatus and method Soldering apparatus and method

2006-12-08

2011-11-01

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S047100, C228S049500, C228S056100

Reexamination Certificate

active

08047418

ABSTRACT:
A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.

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