Soldering apparatus and method

Metal fusion bonding – Specialized pot – Having means to treat flux or filler

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Details

118 57, 118423, 118429, 118500, B23K 306

Patent

active

053619641

ABSTRACT:
Apparatus (1) for applying solder to electrical components such as integrated circuit packages (2) has a chamber (4) which contains a body of solder. The chamber (4) has outlet openings (10) which are below the surface of the solder and from which a flow of solder is provided. Since dross (oxidized solder) floats on the surface of the solder, the flow of solder is relatively pure. The leads of the packages are dipped into the flow of solder so that they are coated with a protective layer of solder. Vibrational apparatus (2) is also provided to vibrate the circuit packages (2) during the dipping of the packages (2) into the solder flow. In this way solder is prevented from bridging the spacing between two closely spaced, adjacent leads.

REFERENCES:
patent: 3661638 (1972-05-01), Lemecha
patent: 3767102 (1973-10-01), Parsons
patent: 3834015 (1974-09-01), Di Renzo
patent: 4210095 (1980-07-01), Rouquie
patent: 5164010 (1992-11-01), Morozumi
patent: 5260098 (1993-11-01), Trentesaux et al.

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