Soldering apparatus and method

Details Soldering apparatus and method Soldering apparatus and method

1993-03-17

1994-11-08

Ramsey, Kenneth J.

Metal fusion bonding

Specialized pot

Having means to treat flux or filler

118 57, 118423, 118429, 118500, B23K 306

Patent

active

053619641

ABSTRACT:
Apparatus (1) for applying solder to electrical components such as integrated circuit packages (2) has a chamber (4) which contains a body of solder. The chamber (4) has outlet openings (10) which are below the surface of the solder and from which a flow of solder is provided. Since dross (oxidized solder) floats on the surface of the solder, the flow of solder is relatively pure. The leads of the packages are dipped into the flow of solder so that they are coated with a protective layer of solder. Vibrational apparatus (2) is also provided to vibrate the circuit packages (2) during the dipping of the packages (2) into the solder flow. In this way solder is prevented from bridging the spacing between two closely spaced, adjacent leads.

REFERENCES:
patent: 3661638 (1972-05-01), Lemecha
patent: 3767102 (1973-10-01), Parsons
patent: 3834015 (1974-09-01), Di Renzo
patent: 4210095 (1980-07-01), Rouquie
patent: 5164010 (1992-11-01), Morozumi
patent: 5260098 (1993-11-01), Trentesaux et al.

Affiliated with

Also associated with

Rating

Soldering apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1776126