Soldering apparatus and method

Details Soldering apparatus and method Soldering apparatus and method

1998-06-09

2000-12-26

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 41, 228 33, 228 61, 228 31, 228 46, 228 42, B23K 100, B23K 108, B23K 500, B23K 2008, B23K 2014

Patent

active

061645168

ABSTRACT:
An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of the printed circuit board on which leads of chips and other electronic parts are to be electrically connected to circuits as printed, a flux applicator located downstream of the heater and arranged to apply a molten flux to the surface of the printed circuit board, and a supply of solder located downstream of the flux applicator and arranged to solder the leads to the circuits. The flux applicator includes a supply of flux for feeding flux in solid form at room temperature, a heater for heating the flux to a temperature above its melting point to provide a molten flux, and a spray nozzle for spraying the molten flux to the surface of the substrate. A supply of hot air is operatively associated with the spray nozzle and adapted to supply hot air under pressure to the spray nozzle, whereby a mist of the molten flux is sprayed onto the surface of the printed circuit board.

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