Soldering apparatus

Details Soldering apparatus Soldering apparatus

1983-12-16

1985-07-23

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 37, 228 43, B23K 108, B23K 306

Patent

active

045304580

ABSTRACT:
Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.

REFERENCES:
patent: 4101066 (1978-07-01), Corsaro
patent: 4171761 (1979-10-01), Boldt et al.
patent: 4208002 (1980-06-01), Comerford
patent: 4465219 (1984-08-01), Kondo

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