Soldering apparatus

Metal fusion bonding – Metallic heat applicator

Patent

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Details

228 55, 219230, 174 51, B23K 302

Patent

active

049038842

ABSTRACT:
Soldering apparatus of the kind having a replaceable tip element including a soldering face and having a frame portion and a tip retaining portion adapted to retain the tip element in heat conducting relationship with the frame portion. The soldering apparatus is characterized in that the frame portion incorporates a contact assisting formation adapted to embed itself at least partly into the tip element remote from the soldering face to thereby reduce electrical resistance between the tip element and frame.

REFERENCES:
patent: 3111101 (1963-11-01), Boggs, Sr. et al.
patent: 3236932 (1966-02-01), Grigas et al.
patent: 3435126 (1969-03-01), Hamilton
patent: 3904932 (1975-09-01), Langlie et al.
patent: 4086465 (1978-04-01), Sylvester
patent: 4322773 (1982-03-01), Bordner
patent: 4473714 (1984-09-01), Brownell et al.

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