Soldering apparatus

Details Soldering apparatus Soldering apparatus

1977-04-11

1978-09-12

Kaplan, Morris

Coating apparatus

Immersion or work-confined pool type

With tank structure, liquid supply, control, and/or...

118612, B05C 305

Patent

active

041128680

ABSTRACT:
A difficultly solderable metal of iron, nickel, copper or an alloy thereof having an oxide surface is soldered by dipping in a bath of a molten solder alloy consisting essentially of 15 to 98% by weight of Zn, 85 to 2% by weight of Sn, 0.01 to 0.5% by weight of Al and 0 to 5% by weight of Ag to which ultrasonic vibration is applied. The bath structure comprises a vessel, a tip element for imparting ultrasonic vibration and a block member for concentrating the ultrasonic vibration. Said element and member being fabricated of a metal selected from the group consisting of tantalum, niobium, molybdenum, tungsten and an alloy thereof having at least one of these metals as the main component.

REFERENCES:
patent: 2970933 (1961-02-01), Barera et al.
patent: 3287158 (1966-11-01), Whitfield
patent: 3313914 (1967-04-01), Roberts, Jr. et al.
patent: 3401026 (1968-09-01), Walker et al.
patent: 3554512 (1971-01-01), Elliott et al.
patent: 3617348 (1971-11-01), Kelley et al.

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