Soldering apparatus

Details Soldering apparatus Soldering apparatus

1982-12-23

1986-02-04

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

2281801, 228260, 118429, H05K 334

Patent

active

045680124

ABSTRACT:
A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel communicating with a portion of the solder tank remote form the nozzle and the interior of the nozzle. A moving magnetic field generating mechanism for exerting a force toward the nozzle to a solder in the channel is arranged in the base to extend along the channel under the partition wall. That portion of the solder tank at the side of the nozzle constitutes a wide portion of the same width as that of the nozzle while the remaining portion of the solder tank constitutes a narrow portion.

REFERENCES:
patent: 2985106 (1961-05-01), Rhudy
patent: 3263283 (1966-08-01), Allard
patent: 3797724 (1974-03-01), Flury et al.
patent: 3941088 (1976-03-01), Ronafoldi
patent: 3942577 (1976-03-01), Vozumi
patent: 4072777 (1978-02-01), Schoenthaler

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