Soldering apparatus

Details Soldering apparatus Soldering apparatus

1987-03-31

1989-01-10

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228179, 2281801, H05K 334, B23K 102

Patent

active

047967960

ABSTRACT:
A soldering apparatus comprising a soldering station (10) with a system for producing at least one soldering wave (P2, P3) and a transport device extending above the soldering station (10). Several resilient supporting elements (18) are arranged in one or more rows at right angles to the direction of transport (P1) for resiliently supporting a printed circuit board (24) to be subjected to a soldering treatment. Due to the supporting elements (18), sagging of the board (24) and flushing of the board with solder are avoided (FIG. 3).

REFERENCES:
patent: 3135630 (1964-06-01), Bielinski et al.
patent: 3465415 (1969-09-01), Walls
patent: 3565319 (1971-02-01), Eschenberger
patent: 3593677 (1971-07-01), McLain
patent: 4139143 (1979-02-01), Gumprecht

Affiliated with

Also associated with

Rating

Soldering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2103926