Soldering apparatus

Details Soldering apparatus Soldering apparatus

1979-12-18

1982-01-19

Weidenfeld, Gil

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 43, 228180R, 228259, 134 83, 198342, H05K 334

Patent

active

043112668

ABSTRACT:
An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining a part of the transfer path and adapted for supporting engagement with the carrier; a vessel containing molten solder placed beneath the space between the rails; and driving means for moving the rails up and down to allow the printed circuit board to be dipped in the molten solder.

REFERENCES:
patent: 3828419 (1974-08-01), Wanner

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