Electric heating – Metal heating – For bonding with pressure
Patent
1985-12-16
1987-03-17
Goldberg, E. A.
Electric heating
Metal heating
For bonding with pressure
219 85R, 219349, B23K 112
Patent
active
046509500
ABSTRACT:
Soldering apparatus for effecting, for example, a firm connection of the lead pins on IC-packages to a printed circuit board bearing corresponding lead lines. The workpiece such as an IC-package is placed at a predetermined position on the printed circuit board such that the lead pins on the IC-package and the corresponding lead lines on the circuit board, on which the solder has been applied, are in contact with each other. These sites of contact are subjected to radiant heating to cause soldering of them, by the use of apparatus which comprises a mounting base provided with a pair of diagonally disposed arms together with, if necessary, another pair of arms disposed also diagonally but rectangularly to the first pair of arms. Heat sources such as lamp units produce the radiant heat rays and focus them onto the sites of contact of the lead pins with the lead lines to be soldered. Each of the lamp units is hingedly connected to the distal end of each of the arms so as to permit individual adjustment of the angle of inclination of the lamp unit around an axis of angular adjustment. A support shaft adjustable as to its vertical position relative to the work table passes slidably through the mounting base and supports a press plate for bearing the IC-package at its lower end.
REFERENCES:
patent: 2318533 (1943-05-01), Selvig
patent: 3486004 (1969-12-01), Morrone
patent: 3520055 (1970-07-01), Jannett
patent: 3522407 (1970-08-01), Costello
patent: 3683146 (1972-08-01), Nugent et al.
Hayakawa Futomi
Onoda Kazuo
Goldberg E. A.
Hy-Bec Corporation
Sigda C. M.
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