Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent
1993-11-29
1994-10-25
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Gaseous flux
219388, 432152, B23K 100
Patent
active
053581679
ABSTRACT:
A soldering apparatus is disclosed which includes a longitudinally extending, air-tight housing having four contiguous, first through fourth zones and and inlet and outlet openings at both longitudinal ends thereof, a conveyer for conveying an article to be soldered along a predetermined path extending through the inlet opening, the first to fourth zones and the outlet opening, a soldering device provided in the second zone for applying a molten solder to the article traveling through the second zone, a plurality of upper and lower partition plates disposed in each of the first, third and fourth zones to partition each zone into a plurality of open ended chambers, an inert gas diffuser provided within at least one of the chambers of the third zone, and an air diffuser provided within at least one of the chambers of the fourth zone, so that the diffusion of air from the fourth zone to the third zone is substantially prevented while the diffusion of the inert gas from the third zone to the outlet opening through the fourth zone is reduced.
REFERENCES:
patent: 5147083 (1992-09-01), Halstead et al.
patent: 5230460 (1993-07-01), Deamborsio et al.
Kanazawa Masaru
Nakamura Kimihiko
Nozue Masahito
Tachibana Yoshiaki
Yasuoka Toshikazu
Nihon Den-Netsu Keiki Co. Ltd.
OKI Electric Industry Co., Ltd.
Ramsey Kenneth J.
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